Počet záznamů: 1

Recovery stress and shape memory stability in Ni-Ti-Cu thin wires at high temperatures

  1. 1.
    0368419 - FZU-D 2012 RIV DE eng J - Článek v odborném periodiku
    Molnár, Peter - Van Humbeeck, J.
    Recovery stress and shape memory stability in Ni-Ti-Cu thin wires at high temperatures.
    International Journal of Materials Research. Roč. 102, č. 11 (2011), s. 1362-1368 ISSN 1862-5282
    Výzkumný záměr: CEZ:AV0Z10100520
    Klíčová slova: shape memory alloys * recovery stress * Ni-Ti-Cu * stress relaxation
    Kód oboru RIV: BM - Fyzika pevných látek a magnetismus
    Impakt faktor: 0.830, rok: 2011
    http://www.ijmr.de/directlink.asp?MK110596

    The recovery stress evolution during thermal cycling (heating, isothermal holding, cooling) to temperatures significantly above the austenite finish temperature in Ni –Ti – Cu thin wires was evaluated in a dynamic mechanical analyser DMA TQ800. Ni –Ti–Cu wires were annealed at four different temperatures (350 °C, 450°C, 550 °C and 650 °C). It was observed that the maximum recovery stress significantly decreases with increasing annealing temperature. It was also observed that the recovery stress during four isothermal holdings shows similar behaviour for all annealing temperatures, i. e. stress relaxation occurs after initial stress increase during the first isothermal holding and no stress relaxation is observed during isothermal holdings in subsequent thermal cycles.
    Trvalý link: http://hdl.handle.net/11104/0202767