Počet záznamů: 1
Automated System for Optical Inspection of Defects in Resist-coated Non-patterned Wafer
- 1.
SYSNO ASEP 0532029 Druh ASEP J - Článek v odborném periodiku Zařazení RIV J - Článek v odborném periodiku Poddruh J Článek ve WOS Název Automated System for Optical Inspection of Defects in Resist-coated Non-patterned Wafer Tvůrce(i) Knápek, Alexandr (UPT-D) RID, ORCID, SAI
Drozd, Michal (UPT-D)
Matějka, Milan (UPT-D) RID, ORCID, SAI
Chlumská, Jana (UPT-D) RID, ORCID, SAI
Král, Stanislav (UPT-D) RID, SAI
Kolařík, Vladimír (UPT-D) RID, ORCID, SAICelkový počet autorů 6 Zdroj.dok. Jordan Journal of Physics. - : Yarmouk University - ISSN 1994-7607
Roč. 13, č. 2 (2020), s. 93-100Poč.str. 8 s. Forma vydání Tištěná - P Jazyk dok. eng - angličtina Země vyd. JO - Jordánsko Klíč. slova optical inspection ; resist layer ; non-patterned wafer ; quality control Vědní obor RIV JA - Elektronika a optoelektronika, elektrotechnika Obor OECD Automation and control systems CEP FV10618 GA MPO - Ministerstvo průmyslu a obchodu Způsob publikování Open access Institucionální podpora UPT-D - RVO:68081731 UT WOS 000559771600001 EID SCOPUS 85091405823 DOI 10.47011/13.2.1 Anotace Quality control of the resist coating on a silicon wafer is one of the major tasks prior to the exposition of patterns into the resist layer. Thus, the ability to inspect and identify the physical defect in the resist layer plays an important role. The absence of any unwanted defect in resist is an ultimate requirement for preparation of precise and functional micro- or nano-patterned surfaces. Currently used wafer inspection systems are mostly utilized in semiconductor or microelectronic industry to inspect non-patterned or patterned wafers (integrated circuits, photomasks,. etc.) in order to achieve high yield production. Typically, they are based on acoustic micro-imaging, optical imaging or electron microscopy. This paper presents the design of a custom optical-based inspection device for small batch lithography production that allows scanning a wafer surface with an optical camera and by analyzing the captured images to determine the coordinates (X, Y), the size and the type of the defects in the resist layer. In addition, software responsible for driving the scanning device and for advanced image processing is presented. Pracoviště Ústav přístrojové techniky Kontakt Martina Šillerová, sillerova@ISIBrno.Cz, Tel.: 541 514 178 Rok sběru 2021 Elektronická adresa http://journals.yu.edu.jo/jjp/JJPIssues/Vol13No2pdf2020/1.html
Počet záznamů: 1