Počet záznamů: 1  

Automated system for optical inspection of defects in resist coated non-patterned wafer.

  1. 1.
    SYSNO ASEP0512149
    Druh ASEPA - Abstrakt
    Zařazení RIVZáznam nebyl označen do RIV
    Zařazení RIVNení vybrán druh dokumentu
    NázevAutomated system for optical inspection of defects in resist coated non-patterned wafer.
    Tvůrce(i) Knápek, Alexandr (UPT-D) RID, ORCID, SAI
    Drozd, Michal (UPT-D)
    Matějka, Milan (UPT-D) RID, ORCID, SAI
    Chlumská, Jana (UPT-D) RID, ORCID, SAI
    Král, Stanislav (UPT-D) RID, SAI
    Kolařík, Vladimír (UPT-D) RID, ORCID, SAI
    Celkový počet autorů6
    Zdroj.dok.Fourth International Symposium on Dielectric Materials and Applications (ISyDMA 4). Book of Abstracts. - Amman : Jordan University of Science & Technology, 2019
    Poč.str.1 s.
    Forma vydáníTištěná - P
    AkceThe Fourth International Symposium on Dielectric Materials and Applications (ISyDMA 4)
    Datum konání02.05.2019 - 04.05.2019
    Místo konáníAmman
    ZeměJO - Jordánsko
    Typ akceWRD
    Jazyk dok.eng - angličtina
    Země vyd.JO - Jordánsko
    Klíč. slovadielectric surface inspection ; resist coated wafer
    Vědní obor RIVJA - Elektronika a optoelektronika, elektrotechnika
    CEPFV10618 GA MPO - Ministerstvo průmyslu a obchodu
    Institucionální podporaUPT-D - RVO:68081731
    AnotaceQuality control of the resist coating on the silicon wafer is one of the major task prior the exposition of patterns into the resist layer. Thus, the ability to inspect and identify the physical defect in the resist layer plays an important role. The absence of any unwanted defect in resist is an ultimate requirement for preparation of precise and functional micro- or nano-patterned surfaces. Currently used wafer inspection systems is mostly used in semiconductor or microelectronic industry to inspect non-patterned or patterned wafers (integrated circuits, photomasks, MEMS, etc.) in order to achieve production with high yield. Typically, they are based on acoustic micro imaging, optical imaging or electron microscopy. This paper presents design of a custom optical based inspection device for small batch lithography production that allows scanning a wafer surface with an optical camera and by analyzing the captured images to determine the coordinates (X, Y), size and type of the defects in the resist layer. In addition, a software that is responsible for driving the scanning device and for advanced image processing is presented.
    PracovištěÚstav přístrojové techniky
    KontaktMartina Šillerová, sillerova@ISIBrno.Cz, Tel.: 541 514 178
    Rok sběru2020
Počet záznamů: 1