Počet záznamů: 1
Automated system for optical inspection of defects in resist coated non-patterned wafer.
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SYSNO ASEP 0512149 Druh ASEP A - Abstrakt Zařazení RIV Záznam nebyl označen do RIV Zařazení RIV Není vybrán druh dokumentu Název Automated system for optical inspection of defects in resist coated non-patterned wafer. Tvůrce(i) Knápek, Alexandr (UPT-D) RID, ORCID, SAI
Drozd, Michal (UPT-D)
Matějka, Milan (UPT-D) RID, ORCID, SAI
Chlumská, Jana (UPT-D) RID, ORCID, SAI
Král, Stanislav (UPT-D) RID, SAI
Kolařík, Vladimír (UPT-D) RID, ORCID, SAICelkový počet autorů 6 Zdroj.dok. Fourth International Symposium on Dielectric Materials and Applications (ISyDMA 4). Book of Abstracts. - Amman : Jordan University of Science & Technology, 2019 Poč.str. 1 s. Forma vydání Tištěná - P Akce The Fourth International Symposium on Dielectric Materials and Applications (ISyDMA 4) Datum konání 02.05.2019 - 04.05.2019 Místo konání Amman Země JO - Jordánsko Typ akce WRD Jazyk dok. eng - angličtina Země vyd. JO - Jordánsko Klíč. slova dielectric surface inspection ; resist coated wafer Vědní obor RIV JA - Elektronika a optoelektronika, elektrotechnika CEP FV10618 GA MPO - Ministerstvo průmyslu a obchodu Institucionální podpora UPT-D - RVO:68081731 Anotace Quality control of the resist coating on the silicon wafer is one of the major task prior the exposition of patterns into the resist layer. Thus, the ability to inspect and identify the physical defect in the resist layer plays an important role. The absence of any unwanted defect in resist is an ultimate requirement for preparation of precise and functional micro- or nano-patterned surfaces. Currently used wafer inspection systems is mostly used in semiconductor or microelectronic industry to inspect non-patterned or patterned wafers (integrated circuits, photomasks, MEMS, etc.) in order to achieve production with high yield. Typically, they are based on acoustic micro imaging, optical imaging or electron microscopy. This paper presents design of a custom optical based inspection device for small batch lithography production that allows scanning a wafer surface with an optical camera and by analyzing the captured images to determine the coordinates (X, Y), size and type of the defects in the resist layer. In addition, a software that is responsible for driving the scanning device and for advanced image processing is presented. Pracoviště Ústav přístrojové techniky Kontakt Martina Šillerová, sillerova@ISIBrno.Cz, Tel.: 541 514 178 Rok sběru 2020
Počet záznamů: 1