Počet záznamů: 1
Low conductive thermal insulation pad with high mechanical stiffness
- 1.Hanzelka, Pavel - Dupák, Libor - Krutil, Vojtěch - Krzyžánek, Vladislav - Skoupý, Radim - Srnka, Aleš - Vlček, Ivan - Urban, Pavel
Low conductive thermal insulation pad with high mechanical stiffness.
16th Multinational Congress on Microscopy, 16MCM, 04-09 September 2022, Brno, Czech Republic. Book of abstracts. Brno: Czechoslovak Microscopy Society, 2022 - (Krzyžánek, V.; Hrubanová, K.; Hozák, P.; Müllerová, I.; Šlouf, M.). s. 152-153. ISBN 978-80-11-02253-2.
[Multinational Congress on Microscopy /16./. 04.09.2022-09.09.2022, Brno]
Obor OECD: Thermodynamics
https://www.16mcm.cz/wp-content/uploads/2022/09/16MCM-abstract-book.pdf
https://hdl.handle.net/11104/0339783
Počet záznamů: 1