Near threshold fatigue crack growth in ultrafine-grained copper

0484637 - ÚFM 2018 RIV GB eng C - Konferenční příspěvek (zahraniční konf.)
Arzaghi, M. - Fintová, S. - Sarrazin-Baudoux, C. - Kunz, Ludvík - Petit, J.
Near threshold fatigue crack growth in ultrafine-grained copper.
6TH INTERNATIONAL CONFERENCE ON NANOMATERIALS BY SEVERE PLASTIC DEFORMATION (NANOSPD6). Bristol: IOP PUBLISHING LTD, 2014, č. článku UNSP 012158. 63. ISSN 1757-8981.
[NanoSPD6 - International Conference on Nanomaterials by Severe Plastic Deformation /6./. Metz (FR), 30.06.2014-04.07.2014]
Grant CEP: GA ČR GAP108/10/2001
Institucionální podpora: RVO:68081723
Klíčová slova: SEVERE PLASTIC-DEFORMATION * BEHAVIOR * ALLOYS * METALS
Obor OECD: Audio engineering, reliability analysis

The near threshold fatigue crack growth in ultrafine-grained (UFG) copper at room temperature was studied in comparison to conventional coarse-grained (CG) copper. The fatigue crack growth rates da/dN in UFG copper were enhanced at Delta K <= 7 MPa root m compared to the CG material. The crack closure shielding, as evaluated using the compliance variation technique, was shown to explain these differences. The effective stress intensity factor amplitude Delta K-eff appears to be the same driving force in both materials. Tests performed in high vacuum on UFG copper demonstrate the existence of a huge effect of environment with growth rates higher of about two orders of magnitude in air compared to high vacuum. This environmental effect on the crack path and the related microstructure is discussed on the basis of fractography observations performed using scanning electron microscope and completed with field emission scanning electron microscope combined with the focused ion beam technique.
Trvalý link: http://hdl.handle.net/11104/0279814