Handbook of High-temperature Lead-free Solders: Group Project Reports

Moelans, N., Botsis, J., Čička, R., Cugnoni, J., Durga, A., Danielewski, M., Drápala, J., Drienovský, M., Guan, Y., Harcuba, P., Janczak-Rusch, J., Janovec, J., Kodentsov, A.A., Kroupa, A., Kubíček, P., Kudyba, A., Maleki, M., Novakovic, R., Nowak, R., Ožvold, M., Pawelkiewicz, M., Pietrzak, K., Pocisková Dimová, K., Rízeková Trnková, L., Scheller, M., Sienicki, E., Sobczak, N., Sosnowska, K. K., Toporek, G., Vodárek, V., Zemanová, A., Zolliker, P. GP5- Modeling and experimental investigation of the microstructural changes in the interdiffusion zone of leadfree solder joints. In: KROUPA, A., ed. Handbook of High-temperature Lead-free Solders: Group Project Reports. Brno: COST office, 2012, s. 109-180. COST MPO602, Vol 3. ISBN 978-80-905363-3-3.