Handbook of High-temperature Lead-free Solders: Group Project Reports

MOELANS, N., BOTSIS, J., ČIČKA, R., CUGNONI, J., DURGA, A., DANIELEWSKI, M., DRÁPALA, J., DRIENOVSKÝ, M., GUAN, Y., HARCUBA, P., JANCZAK-RUSCH, J., JANOVEC, J., KODENTSOV, A.A., KROUPA, A., KUBÍČEK, P., KUDYBA, A., MALEKI, M., NOVAKOVIC, R., NOWAK, R., OŽVOLD, M., PAWELKIEWICZ, M., PIETRZAK, K., POCISKOVÁ DIMOVÁ, K., RÍZEKOVÁ TRNKOVÁ, L., SCHELLER, M., SIENICKI, E., SOBCZAK, N., SOSNOWSKA, K. K., TOPOREK, G., VODÁREK, V., ZEMANOVÁ, A., ZOLLIKER, P. GP5- Modeling and experimental investigation of the microstructural changes in the interdiffusion zone of leadfree solder joints. In: KROUPA, A., ed. Handbook of High-temperature Lead-free Solders: Group Project Reports. Brno: COST office, 2012, s. 109-180. COST MPO602, Vol 3. ISBN 978-80-905363-3-3.