Cleaning of tungsten tips for subsequent cold field emission application

0584772 - ÚPT 2024 CZ eng A - Abstrakt
Košelová, Zuzana - Horáková, L. - Allaham, Mohammad M. - Burda, Daniel - Knápek, Alexandr - Fohlerová, Z.
Cleaning of tungsten tips for subsequent cold field emission application.
IMAPS Flash Conference. 9th International Microelectronics Assembly and Packaging Society Flash Conference. Extended abstracts. Brno: Brno University of Technology, FEEC, 2023 - (Otáhal, A.; Szendiuch, I.; Skácel, J.). s. 50-51. ISBN 978-80-214-6185-7.
[IMAPS Flash Conference 2023. International Microelectronics Assembly and Packaging Society Flash Conference /9./. 26.10.2023-27.10.2023, Brno]
Výzkumná infrastruktura: CzechNanoLab - 90110
Institucionální podpora: RVO:68081731
Klíčová slova: Cleaning * Cold field emission * Tungsten tips * Macroetching * Hydrofluoric acid
Obor OECD: Electrical and electronic engineering

An important aspect of many applications involves the cleaning of crucial components, which can vary depending on their subsequent use (e.g., vacuum level, ongoing chemical reactions, sample sensitivity, etc.). In this study, we will address the cleaning of cold field emission electron emitters, where a clean surface is required for subsequent layer deposition and to classify the nature of the resulting interface.
Trvalý link: https://hdl.handle.net/11104/0352620