When 2D materials meet metals

0583603 - ÚFCH JH 2025 RIV GB eng J - Článek v odborném periodiku
Pirker, Luka - Honolka, Jan - Velický, Matěj - Frank, Otakar
When 2D materials meet metals.
2D Materials. Roč. 11, č. 2 (2024), č. článku 022003. ISSN 2053-1583. E-ISSN 2053-1583
Grant CEP: GA ČR(CZ) GA22-04408S
Grant ostatní: Ministerstvo školství, mládeže a tělovýchovy - GA MŠk(CZ) CZ.02.1.01/0.0/0.0/16_026/0008382
Institucionální podpora: RVO:61388955 ; RVO:68378271
Klíčová slova: 2D materials * metals * interface
Obor OECD: Physical chemistry
Impakt faktor: 5.5, rok: 2022
Způsob publikování: Open access
https://iopscience.iop.org/article/10.1088/2053-1583/ad286b

This review delves into the intricacies of the interfaces formed between two-dimensional (2D) materials and metals, exploring a realm rich with fundamental insights and promising applications. Historically, our understanding of 2D materials emanated from studies employing dielectric substrates or suspended samples. However, integrating metals in the exfoliation and growth processes of 2D materials has opened up new avenues, unveiling various shades of interactions ranging from dispersive forces to covalent bonding. The resulting modifications in 2D materials, particularly transition metal dichalcogenides (TMDCs), offer more than a theoretical intrigue. They bear substantial implications for (opto)electronics, altering Schottky barrier heights and contact resistances in devices. We explore metal-mediated methods for TMDC exfoliation, elucidating the mechanisms and their impact on TMDC-metal interactions. Delving deeper, we scrutinize the fundamentals of these interactions, focusing primarily on MoS2 and Au. Despite the recent surge of interest and extensive studies, critical gaps remain in our understanding of these intricate interfaces. We discuss controversies, such as the changes in Raman or photoemission signatures of MoS2 on Au, and propose potential explanations. The interplay between charge redistribution, substrate-induced bond length variations, and interface charge transfer processes are examined. Finally, we address the intriguing prospect of TMDC phase transitions induced by strongly interacting substrates and their implications for contact design.

Trvalý link: https://hdl.handle.net/11104/0351612