Pressure sensor based on porous polydimethylsiloxane with embedded gold nanoparticles

0541794 - ÚJF 2022 RIV NL eng J - Článek v odborném periodiku
Silipigni, L. - Salvato, G. - Torrisi, A. - Cutroneo, Mariapompea - Slepička, P. - Fajstavr, D. - Torrisi, L.
Pressure sensor based on porous polydimethylsiloxane with embedded gold nanoparticles.
Journal of Materials Science-Materials in Electronics. Roč. 32, APR (2021), s. 8703-8715. ISSN 0957-4522. E-ISSN 1573-482X
Grant CEP: GA ČR GA19-02482S; GA MŠMT EF16_013/0001812
Výzkumná infrastruktura: CANAM II - 90056
Institucionální podpora: RVO:61389005
Klíčová slova: p-PDMS * gold nanoparticles * dielectric properties
Obor OECD: Materials engineering
Impakt faktor: 2.779, rok: 2021
Způsob publikování: Omezený přístup
https://doi.org/10.1007/s10854-021-05541-1

A compressible capacitive mechanical pressure sensor has been developed. Porous polydimethylsiloxane (p-PDMS) has been chosen as dielectric insulator because of its dielectric constant value. Gold nanoparticles have been embedded in p-PDMS to change the dielectric properties and to tune its elasticity. p-PDMS and its nanocomposite have been synthesized using the sugar leaching process. The p-PDMS physical characterization, with and without the gold nanoparticles, has been conducted to investigate its elastic response to compressive stresses as a function of both the polymer preparation thermal treatment and the gold nanoparticle concentration. A sensor operating in a low-pressure range between about 100 Pa and 10 kPa with a strain ranging between about 5% and 95% has been realized. Dielectric constant and electrical resistivity measurements have been performed using samples with a starting volume of the order of 1 cm(3). The relationship between the dielectric constant, the electrical resistivity and the compressive stress/strain has been also deduced. The described sensor is flexible, biocompatible, water equivalent and can have applications in biomedicine (orthopedic, dentistry), engineering (stress-strain measurements, robotics), and microelectronics (microbalances, stress test on electronic devices).
Trvalý link: http://hdl.handle.net/11104/0319481