Effect of Ti Addition on Microstructure of Superconducting Nb3Sn Wires Prepared Using Cu–based Ternary Alloys

0522113 - ÚPT 2020 JP jpn J - Článek v odborném periodiku
Lee, S. - Kawamukai, D. - Hishinuma, Y. - Tsuchiya, T. - Nishimura, K. - Aida, T. - Kikuchi, A. - Mikmeková, Šárka - Taniguchi, H. - Ikeno, S. - Matsuda, K.
Effect of Ti Addition on Microstructure of Superconducting Nb3Sn Wires Prepared Using Cu–based Ternary Alloys.
N. Journal of Japan Institute of Copper. č. 1 (2019), s. 77-81. ISSN 2435-872X. E-ISSN 1347-7234
Institucionální podpora: RVO:68081731
Kód oboru RIV: JA - Elektronika a optoelektronika, elektrotechnika
Způsob publikování: Open access

Titanium （Ti） has been added for improvement of the critical current density （Jc） to Nb3Sn
superconductor. In this work, the effect of Ti on microstructure of Nb3Sn filaments in Nb/Cu–12 mass％
Sn–6 mass％ Zn wires has been investigated by transmission electron microscopy （TEM） and Field
Emission Scanning electron microscopy （FE–SEM）. From the results of SEM observation and FE–SEM
observation, it was confirmed that Nb–Sn intermetallic has been formed at the interface between Nb
filament and Cu alloy for the cross–sections of Ti–free and Ti–bearing wires after heat treatment. Selected
Area Electron Diffraction （SAED） patterns and TEM–EDS profile obtained from Nb–Sn layers in Ti–free
and Ti–bearing wires which were prepared by focused ion beam （FIB） method could be indexed and
analyzed as Nb3Sn of A15 structure. The area fraction of Nb3Sn layer in Ti–bearing wire per unit filament was higher than that in Ti–free
wire. It has been in good agreement with that remained Sn content of the Cu matrix in Ti–bearing was
lower than that in Ti–free wires, and the hardness value by nano–indentor of the Cu matrix in Ti –bearing
wire was also lower than that in Ti–free wire.

Titanium （Ti） has been added for improvement of the critical current density （Jc） to Nb3Sn
superconductor. In this work, the effect of Ti on microstructure of Nb3Sn filaments in Nb/Cu–12 mass％
Sn–6 mass％ Zn wires has been investigated by transmission electron microscopy （TEM） and Field
Emission Scanning electron microscopy （FE–SEM）. From the results of SEM observation and FE–SEM
observation, it was confirmed that Nb–Sn intermetallic has been formed at the interface between Nb
filament and Cu alloy for the cross–sections of Ti–free and Ti–bearing wires after heat treatment. Selected
Area Electron Diffraction （SAED） patterns and TEM–EDS profile obtained from Nb–Sn layers in Ti–free
and Ti–bearing wires which were prepared by focused ion beam （FIB） method could be indexed and
analyzed as Nb3Sn of A15 structure. The area fraction of Nb3Sn layer in Ti–bearing wire per unit filament was higher than that in Ti–free
wire. It has been in good agreement with that remained Sn content of the Cu matrix in Ti–bearing was
lower than that in Ti–free wires, and the hardness value by nano–indentor of the Cu matrix in Ti –bearing
wire was also lower than that in Ti–free wire.
Trvalý link: http://hdl.handle.net/11104/0306622