Pulsed Nd:YAG laser drilling of alumina ceramics and silicon wafers

0483137 - FZÚ 2018 DE eng A - Abstrakt
Chmelíčková, Hana - Havelková, Martina - Hiklová, Helena - Řiháková, L.
Pulsed Nd:YAG laser drilling of alumina ceramics and silicon wafers.
Lasers in Manufacturing (LiM). Book of Abstracts. Munich: WLT, 2017 - (Overmeyer, L.; Reisgen, U.; Ostendorf, A.; Schmidt, M.)
[LiM 2017. Lasers in Manufacturing Conference. 26.06.2017-29.06.2017, Munich]
Grant CEP: GA MŠMT LM2015046
Institucionální podpora: RVO:68378271
Klíčová slova: laser drilling * alumina * silicon * beam quality * numerical model
Obor OECD: Materials engineering

This paper reports about drilling of alumina ceramics samples and silicon slabs with thickness about 2.3 mm, 7.5 mm and 8 mm using a stable and two types of non-stable resonator setups in pulsed Nd:YAG laser KLS 246-102 with different theoretical focus diameter and beam quality. Pulse energy and peak power were increased by setting of charging voltage from 280 V to 370 V with 10 V step for each type of resonator, their maximal values always depend on resonator power limits. Constant burst of pulses is applied on thinner samples to find holes dimensions dependence on peak power, than number of pulses needed to drill complete holes in thicker samples was investigated. Effect of the laser energy input and laser beam diameter on the holes depth and diameters was evaluated for all samples using both laser scanning confocal and optical stereo microscopes.
Trvalý link: http://hdl.handle.net/11104/0278541