Current Problems in Lead-free Soldering, Materials for High-Temperature Lead-free Solders

0370059 - ÚFM 2012 RIV FR eng A - Abstrakt
Kroupa, Aleš
Current Problems in Lead-free Soldering, Materials for High-Temperature Lead-free Solders.
EUROMAT 2011 - European Congress on Advanced Materials and Processes. Montpellier: EUROMAT, 2011. 3021/1/1.
[EUROMAT 2011 - European Congress on Advanced Materials and Processes. 12.09.2011-15.09.2011, Montpellier]
Výzkumný záměr: CEZ:AV0Z20410507
Klíčová slova: lead-free soldering * HISOLD
Kód oboru RIV: BJ - Termodynamika

In industry(especially in electronics), there is now increasing pressure to eliminate lead containing materils. A number of promising materials, for example, SnAgCu-alloys have been developed as replacement for the (near-)eutectic Sn-Pb solders in mainstream applications. The current situation especially in the field of lead free soldering at higher temperatures(mainly between 230-350°C)will be descriebed here.
Trvalý link: http://hdl.handle.net/11104/0203971