Thermodynamic reassessment of the Cu-Ni-Sn system

0354176 - ÚFM 2011 RIV PT eng A - Abstrakt
Zemanová, Adéla - Kroupa, Aleš
Thermodynamic reassessment of the Cu-Ni-Sn system.
TOFA 2010 (Thermodynamics of Alloys 2010). Porto, 2010. s. 46-46.
[TOFA 2010 (Thermodynamics of Alloys 2010). 12.09.2010-16.09.2010, Porto]
Výzkumný záměr: CEZ:AV0Z20410507
Klíčová slova: Cu-Ni-Sn system * thermodynamic database * lead-free soldering
Kód oboru RIV: BJ - Termodynamika

The Cu-Ni-Sn system plays a crucial role in lead-free soldering and therefore, it is important to have its reliable description. The existing assessment of ternary Cu-Ni-Sn system published by Miettien has to be remodelled to include the newest results for binary and ternary systems. New extensive experimental results published by Schmetterer at al. and original results published in were used for the reassessment.
Trvalý link: http://hdl.handle.net/11104/0193236