Number of the records: 1  

Recent challenges in micromachining of wide-bandgap materials and fabrication of MEMS for harsh environments

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    SYSNO ASEP0559035
    Document TypeC - Proceedings Paper (int. conf.)
    R&D Document TypeConference Paper
    TitleRecent challenges in micromachining of wide-bandgap materials and fabrication of MEMS for harsh environments
    Author(s) Zehetner, J. (AT)
    Vanko, G. (SK)
    Dohnal, F. (AT)
    Izsák, T. (SK)
    Držík, M. (SK)
    Kromka, Alexander (FZU-D) RID, ORCID, SAI
    Number of authors6
    Source TitleProceedings of ADEPT - ADEPT 2022. - Žilina : University of Žilina, 2022 / Feiler M. ; Ziman M. ; Kováčová S. ; Kováč, jr. J. - ISBN 978-80-554-1884-1
    Pagess. 7-12
    Number of pages5 s.
    Publication formPrint - P
    Action10th International Conference on Advances in Electronic and Photonic Technologies - ADEPT 2022
    Event date20.06.2022 - 24.06.2022
    VEvent locationTatranská Lomnica
    CountrySK - Slovakia
    Event typeEUR
    Languageeng - English
    CountrySK - Slovakia
    Keywordsharsh environment ; diamond ; SiC ; MEMS ; HEMT ; laser ablation
    Subject RIVJB - Sensors, Measurment, Regulation
    OECD categoryMaterials engineering
    R&D Projects8X20035 GA MŠMT - Ministry of Education, Youth and Sports (MEYS)
    Institutional supportFZU-D - RVO:68378271
    AnnotationThe properties of SiC and diamond make them attractive materials for MEMS and sensor devices. We innovated specific laser ablation techniques to fabricate membranes and cantilevers made of SiC or nano-(micro-) crystalline diamond films grown on Si/SiO2 substrates by microwave chemical vapour deposition (MWCVD). We started research to generate surface moulds to grow corrugated diamond films for membranes and cantilevers. A software tool was developed to support the design of micromechanical cantilevers. We can measure deformation and resonant frequency of diamond cantilevers and identify the global mechanical properties. A benchmark against finite element simulations enables an inverse identification of the specific system parameters and simplifies the characterization procedure.
    WorkplaceInstitute of Physics
    ContactKristina Potocká, potocka@fzu.cz, Tel.: 220 318 579
    Year of Publishing2023
Number of the records: 1  

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