Počet záznamů: 1

Microstructural stability of ultrafine grained copper at elevated temperature

  1. 1.
    0366907 - UFM-A 2012 RIV SK eng J - Článek v odborném periodiku
    Pantělejev, L. - Man, O. - Kunz, Ludvík
    Microstructural stability of ultrafine grained copper at elevated temperature.
    Acta Metallurgica Slovaca. - (Longauerová, M.). Roč. 17, č. 3 (2011), s. 158-162 ISSN 1338-1156
    Výzkumný záměr: CEZ:AV0Z20410507
    Klíčová slova: ultrafine grained microstructure * copper * microstructurral stability * EBSD
    Kód oboru RIV: JG - Hutnictví, kovové materiály

    Thermal stability of ultrafine grained (UFG) structure of 99.9% pure copper produced by eight equal channel angular pressing (ECAP) passes was studied. The annealing experiments were conducted at temperature range from 180 °C to 300 °C in a tube furnace under argon as a protecting gas. The dwell times were in the range from 10 min to 300 min. The electron backscattering diffraction (EBSD) analyses were performed before and after annealing at exactly the same area in order to quantify the changes of UFG structure. More advanced analysis of the EBSD results based on kernel average misorientation (KAM) parameter was performed.
    Trvalý link: http://hdl.handle.net/11104/0201736