Počet záznamů: 1

Silicon monocrystal wafers ground with various abrasive materials

  1. 1.
    0356591 - FZU-D 2011 RIV CZ eng C - Konferenční příspěvek (zahraniční konf.)
    Havelková, Martina - Hiklová, Helena
    Silicon monocrystal wafers ground with various abrasive materials.
    SILICON 2010. 12th Scientific and Business Conference. Rožnov pod Radhoštěm: TECON Scientific, s.r.o., 2010 - (Vojtěchovský, K.), s. 289-290. ISBN 978-80-254-7361-0.
    [Scientific and Business Conference SILICON 2010 /12./. Rožnov pod Radhoštěm (CZ), 02.11.2010-05.11.2010]
    Grant CEP: GA MŠk(CZ) 1M06002; GA AV ČR KAN301370701
    Výzkumný záměr: CEZ:AV0Z10100522
    Klíčová slova: silicon monocrystal * abrasive materials
    Kód oboru RIV: BM - Fyzika pevných látek a magnetismus

    The paper describes measuring of silicon wafers surface. Row of samples were made for different purposes in Themis (Rožnov pod Radhoštěm). The measuring were done with Form Talysurf Series 2 apparatus and the dependence on different conditions of cutting and grinding were monitored.
    Trvalý link: http://hdl.handle.net/11104/0006343