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  1. 1.
    0481625 - ASÚ 2018 US eng C - Conference Paper (international conference)
    Míka, M. - Jankovský, O. - Šimek, P. - Lutyakov, O. - Havlíková, R. - Šofer, Z. - Hudec, René - Pína, L. - Inneman, A. - Švéda, L. - Maršíková, V.
    Slumping of Si wafers at high temperature.
    Damage to VUV, EUV, and X-ray Optics IV; and EUV and X-ray Optics: Synergy between Laboratory and Space III. Bellingham: SPIE, 2013 - (Juha, L.; Bajt, S.; London, R.; Hudec, R.; Pína, L.). Proceedings of SPIE, 8777. ISBN 9780819495792.
    [Damage to VUV, EUV, and X-ray Optics IV; and EUV and X-ray Optics: Synergy between Laboratory and Space III. Praha (CZ), 15.04.2013-18.04.2013]
    Institutional support: RVO:67985815
    Keywords : silicon * x-ray telescope * thermal forming
    Subject RIV: BH - Optics, Masers, Lasers
    OECD category: Electrical and electronic engineering
    Permanent Link: http://hdl.handle.net/11104/0277159