PREPARATION OF W-CU COMPOSITES BY INFILTRATION OF W SKELETONS – REVIEW

1 MATĚJÍČEK Jiří
Institution:
1 Institute of Plasma Physics, Czech Academy of Sciences, Prague, Czech Republic, EU, matejicek@ipp.cas.cz
Conference:
30th Anniversary International Conference on Metallurgy and Materials, Brno, Czech Republic, EU, May 26 - 28, 2021
Proceedings:
Proceedings 30th Anniversary International Conference on Metallurgy and Materials
Pages:
1004-1012
ISBN:
978-80-87294-99-4
ISSN:
2694-9296
Published:
15th September 2021
Proceedings of the conference have already been published in Scopus and we are waiting for evaluation and potential indexing in Web of Science.
Metrics:
441 views / 436 downloads
Abstract

Tungsten–copper composites feature high corrosion and erosion resistance, very good thermal and electrical conductivity, low thermal expansion and good mechanical properties. They are used in a variety of demanding applications, such as arc-resistant electrodes, high voltage electrical contacts, heat sinks for integrated circuits, etc. They are also foreseen for use in plasma-facing components of fusion reactors, e.g. as a transition layer between the (refractory) plasma-facing tungsten and the (highly conductive) copper-based cooling structure. In general, high density and good bonding of the tungsten and copper phases is desired. Molten copper infiltration into tungsten preforms is among the prospective fabrication technologies; the structure and properties of the resultant composites are dependent on the specific technological parameters.In this paper, the preparation of W-Cu composites by infiltration of W skeletons is reviewed and attention is paid to the influence of these particular parameters: infiltration temperature, time and atmosphere, tungsten preform porosity, orientation and chemistry (presence or absence of other elements). Optimum parameter combinations for achieving high density and proper bonding of copper and tungsten are identified.

Keywords: Tungsten, copper, composites, molten copper infiltration

© This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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