Low conductive thermal insulation pad with high mechanical stiffness

Number of the records: 1

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SYSNO	0549376
Title	Low conductive thermal insulation pad with high mechanical stiffness
Author(s)	Hanzelka, Pavel (UPT-D)_{RID, ORCID, SAI} Dupák, Libor (UPT-D)_{RID, ORCID, SAI} Krutil, Vojtěch (UPT-D)_{ORCID, RID, SAI} Krzyžánek, Vladislav (UPT-D)_{RID, ORCID, SAI} Skoupý, Radim (UPT-D)_{RID, ORCID, SAI} Srnka, Aleš (UPT-D)_{RID, ORCID, SAI} Vlček, Ivan (UPT-D)_{RID, ORCID, SAI} Urban, Pavel (UPT-D)_{RID, ORCID, SAI}
Corespondence/senior	Urban, Pavel - Korespondující autor
Source Title	International Journal of Refrigeration. Roč. 132, December (2021), s. 92-99. - : Elsevier
Document Type	Článek v odborném periodiku
Grant	TE01020233 GA TA ČR - Technology Agency of the Czech Republic (TA ČR)
Institutional support	UPT-D - RVO:68081731
Language	eng
Country	GB
Keywords	Cryogenics * Thermal insulation * Microscopy * Sample holder
URL	https://www.sciencedirect.com/science/article/pii/S0140700721003777?via%3Dihub
Permanent Link	http://hdl.handle.net/11104/0325387

Number of the records: 1