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Wetting Properties of Molecularly Rough Surfaces

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    SYSNO ASEP0448504
    Document TypeJ - Journal Article
    R&D Document TypeJournal Article
    Subsidiary JČlánek ve WOS
    TitleWetting Properties of Molecularly Rough Surfaces
    Author(s) Svoboda, Martin (UCHP-M) RID, SAI, ORCID
    Malijevský, Alexandr (UCHP-M) RID, ORCID, SAI
    Lísal, Martin (UCHP-M) RID, ORCID, SAI
    Source TitleJournal of Chemical Physics. - : AIP Publishing - ISSN 0021-9606
    Roč. 143, č. 10 (2015), s. 104701
    Number of pages9 s.
    Languageeng - English
    CountryUS - United States
    Keywordscontant-angle ; solid-surface ; dynamics
    Subject RIVBJ - Thermodynamics
    R&D ProjectsGA13-09914S GA ČR - Czech Science Foundation (CSF)
    LH12020 GA MŠMT - Ministry of Education, Youth and Sports (MEYS)
    Institutional supportUCHP-M - RVO:67985858
    UT WOS000361572900062
    EID SCOPUS84941092320
    DOI10.1063/1.4930084
    AnnotationWe employ molecular dynamics simulations to study the wettability of nanoscale rough surfaces in systems governed by Lennard-Jones (LJ) interactions. We consider both smooth and molecularly rough planar surfaces. Solid substrates are modeled as a static collection of LJ particles arranged in a face-centered cubic lattice with the (100) surface exposed to the LJ fluid. Molecularly rough solid surfaces are prepared by removing several strips of LJ atoms from the external layers of the substrate, i.e., forming parallel nanogrooves on the surface. We vary the solid-fluid interactions to investigate strongly and weakly wettable surfaces. We determine the wetting properties by measuring the equilibrium droplet profiles that are in turn used to evaluate the contact angles. Macroscopic arguments, such as those leading to Wenzel's law, suggest that surface roughness always amplifies the wetting properties of a lyophilic surface. However, our results indicate the opposite effect from roughness for microscopically corrugated surfaces, i.e., surface roughness deteriorates the substrate wettability.
    WorkplaceInstitute of Chemical Process Fundamentals
    ContactEva Jirsová, jirsova@icpf.cas.cz, Tel.: 220 390 227
    Year of Publishing2016
Number of the records: 1  

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