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RIR MAPLE Procedure for Deposition of Carbon Rich Si/C/H Films

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    SYSNO ASEP0424399
    Document TypeJ - Journal Article
    R&D Document TypeJournal Article
    Subsidiary JČlánek ve WOS
    TitleRIR MAPLE Procedure for Deposition of Carbon Rich Si/C/H Films
    Author(s) Dřínek, Vladislav (UCHP-M) RID, ORCID, SAI
    Strašák, Tomáš (UCHP-M) RID, ORCID, SAI
    Novotný, F. (CZ)
    Fajgar, Radek (UCHP-M) RID, ORCID, SAI
    Bastl, Zdeněk (UFCH-W) RID, ORCID
    Source TitleApplied Surface Science. - : Elsevier - ISSN 0169-4332
    Roč. 292, FEB 15 (2014), s. 413-419
    Number of pages7 s.
    Languageeng - English
    CountryNL - Netherlands
    KeywordsMAPLE ; dendrimer ; SiC ; DLC ; cross-kinking
    Subject RIVCA - Inorganic Chemistry
    R&D ProjectsGA13-25747S GA ČR - Czech Science Foundation (CSF)
    Institutional supportUCHP-M - RVO:67985858 ; UFCH-W - RVO:61388955
    UT WOS000330208500056
    DOI10.1016/j.apsusc.2013.11.153
    AnnotationWe applied the resonant infrared matrix assisted pulsed laser evaporation (RIR MAPLE) technique todemonstrate a new approach to a controlled deposition of carbon rich amorphous Si/C/H film. In absenceof radicals and accelerated species commonly generated in PECVD and sputtering setups, the RIR MAPLEmethod does not decompose precursor molecules. Moreover, unlike the standard MAPLE procedure, inwhich solvent molecules absorb laser energy from excimer or near infrared lasers, we applied the pulsedTEA CO2laser to excite the dendrimer precursor molecules in a frozen target. In this manner we achievedjust cross-linking of the starting precursor on substrates and the deposition of carbon rich Si/C/H film. Thefilm was analyzed by Fourier Transformed Infrared (FTIR), UV/VIS, Raman and X-ray Photoelectron (XPS)spectroscopy and Atomic Force Microscopy (AFM) technique. According to analyses the film retained theprecursor elemental composition free of graphitic (sp2) clusters. In course of reaction only the peripheralallyl groups containing C=C bonds were opened to achieve cross-linking. Whereas annealing to 300◦Cwas necessary for the elimination of =C–H1,2bonds in the films prepared at 200◦C, those bonds vanishedcompletely for the films prepared at substrate temperature 255◦C. The film posseses a smooth surfacewith root mean square (RMS) parameter up to 10 nm within scanned distance 2.5 m...
    WorkplaceInstitute of Chemical Process Fundamentals
    ContactEva Jirsová, jirsova@icpf.cas.cz, Tel.: 220 390 227
    Year of Publishing2014
Number of the records: 1  

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