Number of the records: 1
Qualification of 1030 nm ultra-short-pulsed laser for glass sheet treatment in TGV process
- 1.
SYSNO ASEP 0568504 Document Type C - Proceedings Paper (int. conf.) R&D Document Type Conference Paper Title Qualification of 1030 nm ultra-short-pulsed laser for glass sheet treatment in TGV process Author(s) Vanda, Jan (FZU-D) RID, ORCID
Muresan, Mihai-George (FZU-D) ORCID
Čech, Pavel (FZU-D)
Mydlář, Martin (FZU-D)
Pilná, Kateřina (FZU-D)
Smrž, Martin (FZU-D) RID, ORCID
Chyla, Michal (FZU-D) RID, ORCID
Mužík, Jiří (FZU-D) ORCID
Štěpánková, Denisa (FZU-D) ORCID
Brajer, Jan (FZU-D) ORCID
Mocek, Tomáš (FZU-D) RID, ORCID, SAI
Stoklasa, B. (CZ)
Venos, Š. (CZ)
Kuchařík, J. (CZ)Number of authors 14 Article number 1198804 Source Title Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVII. - Bellingham : SPIE, 2022 / Qiao J. ; Narazaki A. ; Gemini L. - ISSN 0277-786X - ISBN 978-1-5106-4848-7 Number of pages 12 s. Publication form Online - E Action SPIE LASE Event date 22.01.2022 - 28.02.2022 VEvent location San Francisco Country US - United States Event type WRD Language eng - English Country US - United States Keywords glasses ; pulsed laser operation ; etching ; laser damage threshold ; laser development ; laser processing Subject RIV BH - Optics, Masers, Lasers OECD category Optics (including laser optics and quantum optics) R&D Projects EF15_006/0000674 GA MŠMT - Ministry of Education, Youth and Sports (MEYS) LO1602 GA MŠMT - Ministry of Education, Youth and Sports (MEYS) LM2015086 GA MŠMT - Ministry of Education, Youth and Sports (MEYS) TM01000021 GA TA ČR - Technology Agency of the Czech Republic (TA ČR) Institutional support FZU-D - RVO:68378271 UT WOS 000844454100003 EID SCOPUS 85131219689 DOI 10.1117/12.2610143 Annotation Glass sheets with ~ 0.1 mm thickness are a promising material from which interposers for high density chip packaging can be produced due to its electrical and mechanical properties. For successful application in microelectronics, it is necessary to develop a way of efficient, high-speed production of interconnecting holes through such glass substrate, socalled through glass vias (TGVs). One of the most promising technique is Laser-Induced Deep Etching (LIDE), where picosecond laser is used to modified particular areas on the glass substrate. Then, using wet etching process, the area exposed to the laser will be etched more quickly than unexposed area. However, effective and large-scale glass modification often requires use of high-energy pulsed UV laser source, which unnecessary complicates the whole application. Here we present effective preparation of treated glass substrate using Yb:YAG laser at its fundamental wavelength 1030 nm, which is capable to overcome such disadvantage. Workplace Institute of Physics Contact Kristina Potocká, potocka@fzu.cz, Tel.: 220 318 579 Year of Publishing 2023 Electronic address https://www.spiedigitallibrary.org/conference-proceedings-of-spie/11988/2610143/Qualification-of-1030-nm-ultra-short-pulsed-laser-for-glass/10.1117/12.2610143.short?SSO=1
Number of the records: 1