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Surface stoichiometry and depth profile of Ti.sub.x./sub.-Cu.sub.y./sub.N.sub.z./sub. thin films deposited by magnetron sputtering

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    SYSNO ASEP0552187
    Document TypeJ - Journal Article
    R&D Document TypeJournal Article
    Subsidiary JČlánek ve WOS
    TitleSurface stoichiometry and depth profile of Tix-CuyNz thin films deposited by magnetron sputtering
    Author(s) Mukhopadhyay, A.K. (IN)
    Roy, A. (IN)
    Bhattacharjee, G. (IN)
    Das, S.C. (IN)
    Majumdar, A. (IN)
    Wulff, H. (DE)
    Hippler, Rainer (FZU-D) ORCID
    Number of authors7
    Article number3191
    Source TitleMaterials. - : MDPI
    Roč. 14, č. 12 (2021)
    Number of pages14 s.
    Languageeng - English
    CountryCH - Switzerland
    Keywordsmagnetron sputtering ; Ti-Cu-N coating ; N incorporation ; X-ray photoelectron spectroscopy ; X-ray diffraction ; transmission electron microscopy
    Subject RIVBL - Plasma and Gas Discharge Physics
    OECD categoryFluids and plasma physics (including surface physics)
    Method of publishingOpen access
    Institutional supportFZU-D - RVO:68378271
    UT WOS000667019900001
    EID SCOPUS85108311702
    DOI10.3390/ma14123191
    AnnotationWe report the surface stoichiometry of Tix-CuyNz thin film as a function of film depth. Films are deposited by high power impulse (HiPIMS) and DC magnetron sputtering (DCMS). The composition of Ti, Cu, and N in the deposited film is investigated by X-ray photoelectron spectroscopy (XPS). At a larger depth, the relative composition of Cu and Ti in the film is increased compared to the surface. The amount of adventitious carbon which is present on the film surface strongly decreases with film depth. Deposited films also contain a significant amount of oxygen whose origin is not fully clear. Grazing incidence X-ray diffraction (GIXD) shows a Cu3N phase on the surface, while transmission electron microscopy (TEM) indicates a polycrystalline structure and the presence of a Ti3CuN phase.
    WorkplaceInstitute of Physics
    ContactKristina Potocká, potocka@fzu.cz, Tel.: 220 318 579
    Year of Publishing2022
    Electronic addresshttp://hdl.handle.net/11104/0327392
Number of the records: 1  

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