Low conductive thermal insulation pad with high mechanical stiffness

Hanzelka, Pavel; Dupák, Libor; Krutil, Vojtěch; Krzyžánek, Vladislav; Skoupý, Radim; Srnka, Aleš; Vlček, Ivan; Urban, Pavel

doi:https://dx.doi.org/10.1016/j.ijrefrig.2021.09.019

Number of the records: 1

Low conductive thermal insulation pad with high mechanical stiffness

1.

SYSNO ASEP	0549376
Document Type	J - Journal Article
R&D Document Type	Journal Article
Subsidiary J	Článek ve WOS
Title	Low conductive thermal insulation pad with high mechanical stiffness
Author(s)	Hanzelka, Pavel (UPT-D)_{RID, ORCID, SAI} Dupák, Libor (UPT-D)_{RID, ORCID, SAI} Krutil, Vojtěch (UPT-D)_{ORCID, RID, SAI} Krzyžánek, Vladislav (UPT-D)_{RID, ORCID, SAI} Skoupý, Radim (UPT-D)_{RID, ORCID, SAI} Srnka, Aleš (UPT-D)_{RID, ORCID, SAI} Vlček, Ivan (UPT-D)_{RID, ORCID, SAI} Urban, Pavel (UPT-D)_{RID, ORCID, SAI}
Number of authors	8
Source Title	International Journal of Refrigeration. - : Elsevier - ISSN 0140-7007 Roč. 132, December (2021), s. 92-99
Number of pages	8 s.
Publication form	Print - P
Language	eng - English
Country	GB - United Kingdom
Keywords	Cryogenics ; Thermal insulation ; Microscopy ; Sample holder
Subject RIV	BJ - Thermodynamics
OECD category	Thermodynamics
R&D Projects	TE01020233 GA TA ČR - Technology Agency of the Czech Republic (TA ČR)
Method of publishing	Open access
Institutional support	UPT-D - RVO:68081731
UT WOS	000729382700010
EID SCOPUS	85120315938
DOI	10.1016/j.ijrefrig.2021.09.019
Annotation	We present a low conductive thermal insulation pad named InBallPad (IBP), which we designed for placing of a sample holder of an ultra-high vacuum scanning probe microscope (UHV SPM) associated with Scanning Electron Microscopy (SEM). The microscope will operate at variable temperatures of sample holder in the range of 20 K – 700 K. IBP with diameter of 30 mm, height of 11 mm and mass of 34 g consists of a top and bottom plate made of titanium alloy which are mutually separated by specially designed low heat conductive glass ball supports. The sample holder is mounted onto the top plate whereas the bottom plate serves for mechanical connection to a piezoelectric scanner of SPM at approximately room temperature. IBP is characterized by a high lateral mechanical stiffness of 106 N/m and a low heat flow of 120 mW between the bottom and the top plate at temperatures of 290 K and 25 K, respectively. The use of the pad is not limited to the UHV SPM only, but the component is generally suitable for any devices where the sample holders work in high or ultra-high vacuum and where a wide temperature span from cryogenic to high temperatures is needed.
Workplace	Institute of Scientific Instruments
Contact	Martina Šillerová, sillerova@ISIBrno.Cz, Tel.: 541 514 178
Year of Publishing	2022
Electronic address	https://www.sciencedirect.com/science/article/pii/S0140700721003777?via%3Dihub

Number of the records: 1