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Contribution of inter- and intraband transitions into electron-phonon coupling in metals
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SYSNO ASEP 0545327 Document Type J - Journal Article R&D Document Type Journal Article Subsidiary J Článek ve WOS Title Contribution of inter- and intraband transitions into electron-phonon coupling in metals Author(s) Medvedev, Nikita (FZU-D) ORCID, RID
Milov, I. (NL)Number of authors 2 Article number 212 Source Title European Physical Journal D. - : Springer - ISSN 1434-6060
Roč. 75, č. 7 (2021)Number of pages 6 s. Language eng - English Country US - United States Keywords electron-photon coupling in metals ; inter- and intraband transitions ; calculations Subject RIV BM - Solid Matter Physics ; Magnetism OECD category Condensed matter physics (including formerly solid state physics, supercond.) R&D Projects LTT17015 GA MŠMT - Ministry of Education, Youth and Sports (MEYS) Research Infrastructure e-INFRA CZ - 90140 - CESNET, zájmové sdružení právnických osob Method of publishing Open access Institutional support FZU-D - RVO:68378271 UT WOS 000691558300001 EID SCOPUS 85111245321 DOI 10.1140/epjd/s10053-021-00200-w Annotation We recently developed an approach for calculation of the electron–phonon (electron–ion in a more general case) coupling in materials based on tight-binding molecular dynamics simulations. In the present work, we utilize this approach to study partial contributions of inter- and intraband electron scattering events into total electron–phonon coupling in Al, Au, and Cu elemental metals and in AlCu alloy. We demonstrate that the interband scattering plays an important role in the electron–ion energy exchange process in Al and AlCu, whereas intraband d–d transitions are dominant in Au and Cu. Moreover, interand intraband transitions exhibit qualitatively different dependencies on the electron temperature. Our findings should be taken into account for the interpretation of experimental results on the electron–phonon coupling parameter.
Workplace Institute of Physics Contact Kristina Potocká, potocka@fzu.cz, Tel.: 220 318 579 Year of Publishing 2022 Electronic address http://hdl.handle.net/11104/0322050
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