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Recent progress of RD53 Collaboration towards next generation pixel read-out chip for HL-LHC

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    SYSNO ASEP0522600
    Document TypeJ - Journal Article
    R&D Document TypeJournal Article
    Subsidiary JČlánek ve WOS
    TitleRecent progress of RD53 Collaboration towards next generation pixel read-out chip for HL-LHC
    Author(s) Demaria, N. (IT)
    Barbero, M.B. (FR)
    Fougeron, D. (FR)
    Kafka, V. (CZ)
    Šícho, Petr (FZU-D) RID, ORCID
    Vrba, Václav (FZU-D) RID
    Number of authors123
    Article numberC12058
    Source TitleJournal of Instrumentation - ISSN 1748-0221
    Roč. 11, č. 12 (2016), s. 1-10
    Number of pages10 s.
    Languageeng - English
    CountryGB - United Kingdom
    KeywordsCERN LHC Coll ; radiation: damage ; electronics: readout ; electronics: design ; electronics: analog ; irradiation
    Subject RIVBF - Elementary Particles and High Energy Physics
    OBOR OECDParticles and field physics
    Způsob publikováníOpen access
    Institutional supportFZU-D - RVO:68378271
    UT WOS000395731900058
    EID SCOPUS85008196553
    DOI10.1088/1748-0221/11/12/C12058
    AnnotationThis paper is a review of recent progress of RD53 Collaboration. Results obtained on the study of the radiation effects on 65 nm CMOS have matured enough to define first strategies to adopt in the design of analog and digital circuits. Critical building blocks and analog very front end chains have been designed, tested before and after 5–800 Mrad. Small prototypes of 64×64 pixels with complex digital architectures have been produced, and point to address the main issues of dealing with extremely high pixel rates, while operating at very small in-time thresholds in the analog front end. The collaboration is now proceeding at full speed towards the design of a large scale prototype, called RD53A, in 65 nm CMOS technology.
    WorkplaceInstitute of Physics
    ContactKristina Potocká, potocka@fzu.cz, Tel.: 220 318 579
    Year of Publishing2020
    Electronic addresshttp://hdl.handle.net/11104/0307067
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