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Surface imaging with UHV SLEEM and SEM LEEM
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SYSNO ASEP 0522221 Document Type A - Abstract R&D Document Type The record was not marked in the RIV R&D Document Type Není vybrán druh dokumentu Title Surface imaging with UHV SLEEM and SEM LEEM Author(s) Mikmeková, Šárka (UPT-D) RID, SAI, ORCID
Jánský, P. (CZ)
Kolařík, V. (CZ)
Müllerová, Ilona (UPT-D) RID, SAI, ORCIDNumber of authors 4 Source Title Microscopy and Microanalysis. - : Cambridge University Press - ISSN 1431-9276
Roč. 25, S2 (2019), s. 444-445Number of pages 2 s. Publication form Print - P Action Microscopy & Microanalysis 2019 Meeting Event date 04.08.2019 - 08.08.2019 VEvent location Portland Country US - United States Event type WRD Language eng - English Country US - United States Keywords surface imaging ; UHV SLEEM ; SEM LEEM Subject RIV JA - Electronics ; Optoelectronics, Electrical Engineering OECD category Materials engineering R&D Projects TE01020118 GA TA ČR - Technology Agency of the Czech Republic (TA ČR) Institutional support UPT-D - RVO:68081731 DOI 10.1017/S1431927619002952 Annotation From fundamental studies in the materials science up to diagnostics of industrial materials a reliable method enabling characterization of surface properties with high sensitivity and high spatial resolution is urgently needed. Low energy electron microscopy method has proven itself eminently sensitive not only to the topography of the sample surface but also to its chemical composition, crystalline structure and electronic configuration.
Workplace Institute of Scientific Instruments Contact Martina Šillerová, sillerova@ISIBrno.Cz, Tel.: 541 514 178 Year of Publishing 2020
Number of the records: 1