Number of the records: 1  

Surface imaging with UHV SLEEM and SEM LEEM

  1. 1.
    SYSNO ASEP0522221
    Document TypeA - Abstract
    R&D Document TypeThe record was not marked in the RIV
    R&D Document TypeNení vybrán druh dokumentu
    TitleSurface imaging with UHV SLEEM and SEM LEEM
    Author(s) Mikmeková, Šárka (UPT-D) RID, SAI, ORCID
    Jánský, P. (CZ)
    Kolařík, V. (CZ)
    Müllerová, Ilona (UPT-D) RID, SAI, ORCID
    Number of authors4
    Source TitleMicroscopy and Microanalysis. - : Cambridge University Press - ISSN 1431-9276
    Roč. 25, S2 (2019), s. 444-445
    Number of pages2 s.
    Publication formPrint - P
    ActionMicroscopy & Microanalysis 2019 Meeting
    Event date04.08.2019 - 08.08.2019
    VEvent locationPortland
    CountryUS - United States
    Event typeWRD
    Languageeng - English
    CountryUS - United States
    Keywordssurface imaging ; UHV SLEEM ; SEM LEEM
    Subject RIVJA - Electronics ; Optoelectronics, Electrical Engineering
    OECD categoryMaterials engineering
    R&D ProjectsTE01020118 GA TA ČR - Technology Agency of the Czech Republic (TA ČR)
    Institutional supportUPT-D - RVO:68081731
    DOI10.1017/S1431927619002952
    AnnotationFrom fundamental studies in the materials science up to diagnostics of industrial materials a reliable method enabling characterization of surface properties with high sensitivity and high spatial resolution is urgently needed. Low energy electron microscopy method has proven itself eminently sensitive not only to the topography of the sample surface but also to its chemical composition, crystalline structure and electronic configuration.

    WorkplaceInstitute of Scientific Instruments
    ContactMartina Šillerová, sillerova@ISIBrno.Cz, Tel.: 541 514 178
    Year of Publishing2020
Number of the records: 1  

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