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Automated system for optical inspection of defects in resist coated non-patterned wafer.

SYSNO ASEP	0512149
Document Type	A - Abstract
R&D Document Type	The record was not marked in the RIV
R&D Document Type	Není vybrán druh dokumentu
Title	Automated system for optical inspection of defects in resist coated non-patterned wafer.
Author(s)	Knápek, Alexandr (UPT-D)_{RID, ORCID, SAI} Drozd, Michal (UPT-D) Matějka, Milan (UPT-D)_{RID, ORCID, SAI} Chlumská, Jana (UPT-D)_{RID, ORCID, SAI} Král, Stanislav (UPT-D)_{RID, SAI} Kolařík, Vladimír (UPT-D)_{RID, ORCID, SAI}
Number of authors	6
Source Title	Fourth International Symposium on Dielectric Materials and Applications (ISyDMA 4). Book of Abstracts. - Amman : Jordan University of Science & Technology, 2019
Number of pages	1 s.
Publication form	Print - P
Action	The Fourth International Symposium on Dielectric Materials and Applications (ISyDMA 4)
Event date	02.05.2019 - 04.05.2019
VEvent location	Amman
Country	JO - Jordan
Event type	WRD
Language	eng - English
Country	JO - Jordan
Keywords	dielectric surface inspection ; resist coated wafer
Subject RIV	JA - Electronics ; Optoelectronics, Electrical Engineering
R&D Projects	FV10618 GA MPO - Ministry of Industry and Trade (MPO)
Institutional support	UPT-D - RVO:68081731
Annotation	Quality control of the resist coating on the silicon wafer is one of the major task prior the exposition of patterns into the resist layer. Thus, the ability to inspect and identify the physical defect in the resist layer plays an important role. The absence of any unwanted defect in resist is an ultimate requirement for preparation of precise and functional micro- or nano-patterned surfaces. Currently used wafer inspection systems is mostly used in semiconductor or microelectronic industry to inspect non-patterned or patterned wafers (integrated circuits, photomasks, MEMS, etc.) in order to achieve production with high yield. Typically, they are based on acoustic micro imaging, optical imaging or electron microscopy. This paper presents design of a custom optical based inspection device for small batch lithography production that allows scanning a wafer surface with an optical camera and by analyzing the captured images to determine the coordinates (X, Y), size and type of the defects in the resist layer. In addition, a software that is responsible for driving the scanning device and for advanced image processing is presented.
Workplace	Institute of Scientific Instruments
Contact	Martina Šillerová, sillerova@ISIBrno.Cz, Tel.: 541 514 178
Year of Publishing	2020

Number of the records: 1