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FeS.sub.2./sub. thin films deposition by reactive high power magnetron sputtering in Ar+H.sub.2./sub.S gas mixture

  1. 1.
    SYSNO ASEP0464298
    Document TypeA - Abstract
    R&D Document TypeO - Ostatní
    TitleFeS2 thin films deposition by reactive high power magnetron sputtering in Ar+H2S gas mixture
    Author(s) Hubička, Zdeněk (FZU-D) RID, ORCID, SAI
    Čada, Martin (FZU-D) RID, ORCID, SAI
    Kment, Štěpán (FZU-D) RID, ORCID
    Olejníček, Jiří (FZU-D) RID, ORCID
    Source TitleInternational Conference on Plasma Surface Engineering. Abstracts. ( PSE 2016 ) /15./. - Braunschweig : European Joint Committee on Plasma and Ion Surface Engineering (EJC / PISE), 2016
    S. 137-137
    Number of pages1 s.
    Publication formOnline - E
    ActionInternational Conference on Plasma Surface Engineering ( PSE 2016 )
    Event date12.09.2016 - 16.09.2016
    VEvent locationGarmisch-Partenkirchen
    CountryDE - Germany
    Event typeWRD
    Languageeng - English
    CountryDE - Germany
    Keywordssputtering ; HIPIMS ; films ; semiconductor ; deposition
    Subject RIVBL - Plasma and Gas Discharge Physics
    R&D ProjectsTA03010743 GA TA ČR - Technology Agency of the Czech Republic (TA ČR)
    Institutional supportFZU-D - RVO:68378271
    AnnotationPolycrystalline and nanocrystalline semiconducting iron pyrite FeS2 is recently an attractive material for optoelectronic and photonic applications. Due to its relatively large optical absorption coefficient in the visible region and narrow band gap of 0.95 ev this material can be suitable for applications in photovoltaics, photodetectors and photoelectrochemistry. Semiconducting polycrystalline and nanocrystalline FeS2 thin films were deposited by high power impulse magnetron reactive sputtering system (R-HIPIMS). The magnetron system with SmCo magnets and a pure circular iron target (diameter 50 mm) was used for the impulse reactive sputtering. The gas mixture of Ar and H2S was used for the reactive sputtering process. The partial pressure of H2S in the deposition plasma reactor was changed in a wide range. The substrate was heated during the deposition by an external furnace and the deposition temperature was controlled in the range 300-600 K.
    WorkplaceInstitute of Physics
    ContactKristina Potocká, potocka@fzu.cz, Tel.: 220 318 579
    Year of Publishing2017
Number of the records: 1  

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