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Single Layer Molybdenum Disulfide under Direct Out-of-Plane Compression: Low-Stress Band-Gap Engineering

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    SYSNO ASEP0443984
    Document TypeJ - Journal Article
    R&D Document TypeJournal Article
    Subsidiary JČlánek ve WOS
    TitleSingle Layer Molybdenum Disulfide under Direct Out-of-Plane Compression: Low-Stress Band-Gap Engineering
    Author(s) Álvarez, M. P. (ES)
    del Corro, Elena (UFCH-W)
    Morales-García, A. (CZ)
    Kavan, Ladislav (UFCH-W) RID, ORCID
    Kalbáč, Martin (UFCH-W) RID, ORCID
    Frank, Otakar (UFCH-W) RID, ORCID
    Source TitleNano Letters. - : American Chemical Society - ISSN 1530-6984
    Roč. 15, č. 5 (2015), s. 3139-3146
    Number of pages8 s.
    Languageeng - English
    CountryUS - United States
    KeywordsMolybdenum disulfide ; band gap engineering ; out-of-plane compression
    Subject RIVCF - Physical ; Theoretical Chemistry
    R&D ProjectsGA14-15357S GA ČR - Czech Science Foundation (CSF)
    LL1301 GA MŠMT - Ministry of Education, Youth and Sports (MEYS)
    Institutional supportUFCH-W - RVO:61388955
    UT WOS000354906000055
    EID SCOPUS84929380204
    DOI10.1021/acs.nanolett.5b00229
    AnnotationTuning the electronic structure of 2D materials is a very powerful asset toward tailoring their properties to suit the demands of future applications in optoelectronics. Strain engineering is one of the most promising methods in this regard. We demonstrate that even very small out-of-plane axial compression readily modifies the electronic structure of monolayer MoS2. As we show through in situ resonant and nonresonant Raman spectroscopy and photoluminescence measurements combined with theoretical calculations, the transition from direct to indirect band gap semiconductor takes place at ~0.5 GPa, and the transition to a semimetal occurs at stress smaller than 3 GPa.
    WorkplaceJ. Heyrovsky Institute of Physical Chemistry
    ContactMichaela Knapová, michaela.knapova@jh-inst.cas.cz, Tel.: 266 053 196
    Year of Publishing2016
Number of the records: 1  

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