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The effect of grain and pore sizes on the mechanical behavior of thin Al films deposited under different conditions
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SYSNO ASEP 0440919 Document Type J - Journal Article R&D Document Type Journal Article Subsidiary J Článek ve WOS Title The effect of grain and pore sizes on the mechanical behavior of thin Al films deposited under different conditions Author(s) Ben-David, E. (IL)
Landa, Michal (UT-L) RID
Janovská, Michaela (UT-L) RID, ORCID
Seiner, Hanuš (UT-L) RID, ORCID
Gutman, O. (IL)
Tepper-Faran, T. (IL)
Shilo, D. (IL)Source Title Acta Materialia. - : Elsevier - ISSN 1359-6454
Roč. 87, April (2015), s. 321-331Number of pages 11 s. Publication form Print - P Language eng - English Country GB - United Kingdom Keywords thin films ; mechanical properties ; tensile tests ; bulge tests ; porosity Subject RIV BM - Solid Matter Physics ; Magnetism Institutional support UT-L - RVO:61388998 UT WOS 000350517700031 EID SCOPUS 84921975347 DOI 10.1016/j.actamat.2014.12.041 Annotation This paper presents a comprehensive study of the relationships between deposition conditions, microstructure and mechanical behavior in thin aluminum films commonly used in micro and nano-devices. A particular focus is placed on the effect of porosity, which is present in all thin films deposited by evaporation or sputtering techniques. Workplace Institute of Thermomechanics Contact Marie Kajprová, kajprova@it.cas.cz, Tel.: 266 053 154 ; Jana Lahovská, jaja@it.cas.cz, Tel.: 266 053 823 Year of Publishing 2016
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