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Handbook of High-temperature Lead-free Solders: Group Project Reports
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SYSNO ASEP 0387915 Document Type M - Monograph Chapter R&D Document Type Monograph Chapter Title GP5- Modeling and experimental investigation of the microstructural changes in the interdiffusion zone of leadfree solder joints Author(s) Moelans, N. (BE)
Botsis, J. (CH)
Čička, R. (SK)
Cugnoni, J. (CH)
Durga, A. (BE)
Danielewski, M. (CH)
Drápala, J. (CZ)
Drienovský, M. (SK)
Guan, Y. (BE)
Harcuba, P. (CZ)
Janczak-Rusch, J. (CH)
Janovec, J. (SK)
Kodentsov, A.A. (NL)
Kroupa, Aleš (UFM-A) RID, ORCID
Kubíček, P. (CZ)
Kudyba, A. (PL)
Maleki, M. (BE)
Novakovic, R. (IT)
Nowak, R. (PL)
Ožvold, M. (SK)
Pawelkiewicz, M. (CH)
Pietrzak, K. (PL)
Pocisková Dimová, K. (SK)
Rízeková Trnková, L. (SK)
Scheller, M. (CH)
Sienicki, E. (PL)
Sobczak, N. (PL)
Sosnowska, K. K. (CH)
Toporek, G. (CH)
Vodárek, V. (CZ)
Zemanová, Adéla (UFM-A) RID, ORCID
Zolliker, P. (CH)Number of authors 32 Source Title Handbook of High-temperature Lead-free Solders: Group Project Reports. - Brno : COST office, 2012 / Kroupa A. - ISBN 978-80-905363-3-3 Pages s. 109-180 Number of pages 72 s. Number of copy 500 Number of pages 320 Publication form Print - P Language eng - English Country CZ - Czech Republic Keywords Leads-free solders ; Modelling of diffusion processes ; Phase field method ; Processes on interface Subject RIV BJ - Thermodynamics R&D Projects OC08053 GA MŠMT - Ministry of Education, Youth and Sports (MEYS) Institutional support UFM-A - RVO:68081723 Annotation The diffusion processes taking part on the interface between the lead-free solder and the substrate were studied experimentally and theoretically. The Phase-field method in combination with thermodynamnic datbases were used to model the development of intermetallic phases at the interface and the properties of such interface were described. Workplace Institute of Physics of Materials Contact Yvonna Šrámková, sramkova@ipm.cz, Tel.: 532 290 485 Year of Publishing 2014
Number of the records: 1