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Mechanical properties and microstructure of model lead-free joints for electronics made with use of nanopowders
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SYSNO ASEP 0382341 Document Type J - Journal Article R&D Document Type Journal Article Subsidiary J Článek ve WOS Title Mechanical properties and microstructure of model lead-free joints for electronics made with use of nanopowders Author(s) Buršík, Jiří (UFM-A) RID, ORCID
Buršíková, V. (CZ)
Pešina, Z. (CZ)
Sopoušek, J. (CZ)Number of authors 4 Source Title Chemické listy. - : Česká společnost chemická - ISSN 0009-2770
Roč. 106, SI (2012), s390-s392Number of pages 3 s. Action Local Mechanical Properties 2011 Event date 09.11.2011-11.11.2011 VEvent location Olomouc Country CZ - Czech Republic Event type EUR Language eng - English Country CZ - Czech Republic Keywords solder ; silver nanopowdwer ; nanoindentation Subject RIV JG - Metallurgy R&D Projects GA106/09/0700 GA ČR - Czech Science Foundation (CSF) CEZ AV0Z20410507 - UFM-A (2005-2011) UT WOS 000314237900008 Annotation In this work, Ag nanopowders were prepared as potential low-toxic constituens of novel solders by a chemical wet synthesis with the aim to study the effect of melting temperature depression and to evaluate the mechanical properties of sintered layers prepared in various annealing regimes. Workplace Institute of Physics of Materials Contact Yvonna Šrámková, sramkova@ipm.cz, Tel.: 532 290 485 Year of Publishing 2013
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