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Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition
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SYSNO ASEP 0368128 Document Type J - Journal Article R&D Document Type Journal Article Subsidiary J Článek ve WOS Title Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition Author(s) Kunz, Ludvík (UFM-A) RID, ORCID
Lukáš, Petr (UFM-A)
Pantělejev, L. (CZ)
Man, O. (CZ)Number of authors 4 Source Title Strain - ISSN 0039-2103
Roč. 2011, č. 47 (2011), 476–482Number of pages 7 s. Language eng - English Country GB - United Kingdom Keywords equal channel angular pressing ; stability of ultrafine-grained microstructure ; fatigue Subject RIV JG - Metallurgy CEZ AV0Z20410507 - UFM-A (2005-2011) UT WOS 000297840000002 DOI 10.1111/j.1475-1305.2009.00710.x Annotation Effect of cyclic loading and thermal exposition on microstructure of bulk ultrafinegrained Cu prepared by equal channel angular pressing was experimentally investigated by means of electron backscattering diffraction and by transmission electron microscopy. Stability of the microstructure under stress-controlled cyclic loading with a tensile mean stress of 200 MPa was shown to be high. Neither dynamic grain coarsening nor development of bimodal microstructure was observed. However, annealing at 250 °C for 30 min resulted in formation of bimodal microstructure. Consequently, fatigue strength of annealed specimens was low. Workplace Institute of Physics of Materials Contact Yvonna Šrámková, sramkova@ipm.cz, Tel.: 532 290 485 Year of Publishing 2012
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