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Interaction of Silver Nanopowder with Cooper Substrate
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SYSNO ASEP 0362863 Document Type J - Journal Article R&D Document Type Journal Article Subsidiary J Článek ve WOS Title Interaction of Silver Nanopowder with Cooper Substrate Author(s) Sopoušek, J. (CZ)
Buršík, Jiří (UFM-A) RID, ORCID
Zálešák, J. (CZ)
Buršíková, V. (CZ)
Brož, P. (CZ)Source Title Science of Sintering - ISSN 0350-820X
Roč. 43, - (2011), s. 33-38Number of pages 6 s. Language eng - English Country BA - Bosnia and Herzegovina Keywords silver ; copper ; sintering Subject RIV JG - Metallurgy R&D Projects GA106/09/0700 GA ČR - Czech Science Foundation (CSF) CEZ AV0Z20410507 - UFM-A (2005-2011) UT WOS 000294191600004 DOI 10.2298/SOS1101033S Annotation Addition of lead into based solders represents a serious health risk and environmental problem. Lead-free solders represent one of the ways to remove pollution of lead Into environment, nevertheless, new advanced joining methods have to be considered. Aggregation effect of nanoparticles studied in this work seems to be an interesting alternative. It was found experimentally that Ag nanopowder annealed at temperatures above silver oxide decomposition forms continuous Ag layer and yields a firm junction between copper plates. Oxide layer is observed at the Cu-Ag interface. The oxide interlayer thickness reflects the temperature and annealing time. Microstructure of prepared experimental joints, composition profiles and local mechanical properties were studied on cross-sectional samples by analytical electron microscopy and depth-sensing indentation technique. Workplace Institute of Physics of Materials Contact Yvonna Šrámková, sramkova@ipm.cz, Tel.: 532 290 485 Year of Publishing 2012
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