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Fatigue damage of ultrafine-grain copper in very-high cycle fatigue region

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    SYSNO ASEP0361095
    Document TypeJ - Journal Article
    R&D Document TypeJournal Article
    Subsidiary JČlánek ve WOS
    TitleFatigue damage of ultrafine-grain copper in very-high cycle fatigue region
    Author(s) Lukáš, Petr (UFM-A)
    Kunz, Ludvík (UFM-A) RID, ORCID
    Navrátilová, Lucie (UFM-A)
    Bokůvka, O. (SK)
    Source TitleMaterials Science and Engineering A Structural Materials Properties Microstructure and Processing. - : Elsevier - ISSN 0921-5093
    Roč. 528, - (2011), s. 7036-7040
    Number of pages5 s.
    Languageeng - English
    CountryCH - Switzerland
    Keywordsultrafine-grained microstructure ; ultrasonic fatigue ; crack initiation ; copper
    Subject RIVJL - Materials Fatigue, Friction Mechanics
    R&D ProjectsGAP108/10/2001 GA ČR - Czech Science Foundation (CSF)
    CEZAV0Z20410507 - UFM-A (2005-2011)
    UT WOS000293363100048
    DOI10.1016/j.msea.2011.06.001
    AnnotationUltrafine-grained copper produced by ECAP technique was tested in ultrasonic fatigue in the region of lives from 108 to 2x1010 cycles. The fatigue strength of ultrafine-grained copper is by a factor of 2 higher than that of conventional-grain copper. The occurrence of surface fatigue slip markings is rare. No grain coarsening was observed either in bulk or in areas underneath the surface slip markings. Localized collective grain-boundary slip of near-by oriented grains is considered to be the main damage mechanism leading to fatigue microcrack initiation either directly in the roots of surface intrusions or underneath the surface slip markings.
    WorkplaceInstitute of Physics of Materials
    ContactYvonna Šrámková, sramkova@ipm.cz, Tel.: 532 290 485
    Year of Publishing2012
Number of the records: 1  

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