Number of the records: 1  

Toward surface-friendly treatment of seeding layer and selected-area diamond growth

  1. 1.
    SYSNO ASEP0354793
    Document TypeJ - Journal Article
    R&D Document TypeJournal Article
    Subsidiary JČlánek ve WOS
    TitleToward surface-friendly treatment of seeding layer and selected-area diamond growth
    Author(s) Babchenko, Oleg (FZU-D) RID, ORCID
    Ižák, Tibor (FZU-D) RID
    Ukraintsev, Egor (FZU-D) RID, ORCID
    Hruška, Karel (FZU-D) RID, ORCID
    Rezek, Bohuslav (FZU-D) RID, ORCID
    Number of authors5
    Source TitlePhysica Status Solidi B : Basic Solid State Physics. - : Wiley - ISSN 0370-1972
    Roč. 247, 11-12 (2010), s. 3026-3029
    Number of pages4 s.
    Languageeng - English
    CountryDE - Germany
    Keywordsdiamond structuring ; lithography ; reactive ion etching ; selected-area deposition
    Subject RIVBM - Solid Matter Physics ; Magnetism
    R&D ProjectsKAN400100701 GA AV ČR - Academy of Sciences of the Czech Republic (AV ČR)
    KAN400480701 GA AV ČR - Academy of Sciences of the Czech Republic (AV ČR)
    LC510 GA MŠMT - Ministry of Education, Youth and Sports (MEYS)
    IAAX00100902 GA AV ČR - Academy of Sciences of the Czech Republic (AV ČR)
    1M06002 GA MŠMT - Ministry of Education, Youth and Sports (MEYS)
    CEZAV0Z10100521 - FZU-D (2005-2011)
    UT WOS000285798400091
    DOI10.1002/pssb.201000124
    AnnotationSeveral technological approaches of applying photoresistive polymer for patterning the diamond seeding layer while minimizing damage of substrate surface is reported. Reactive ion etching (i.e., dry process) and wet photolithographical processing using two polymer layers are compared and combined as treatment techniques. Subsequently, diamond structures are deposited by microwave plasma enhanced chemical vapor deposition from a gas mixture of methane diluted in hydrogen. The highest efficiency for selected-area deposition, with the parasitic density as low as the technological limit of 105 cm−2, was achieved by combining the two treatment techniques. Technological advantages and limitation of dry and wet treatment process are pointed out.
    WorkplaceInstitute of Physics
    ContactKristina Potocká, potocka@fzu.cz, Tel.: 220 318 579
    Year of Publishing2011
Number of the records: 1  

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