Thermodynamic reassessment  of the Cu-Ni-Sn system

Number of the records: 1

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SYSNO ASEP	0354176
Document Type	A - Abstract
R&D Document Type	Není vybrán druh dokumentu
Title	Thermodynamic reassessment of the Cu-Ni-Sn system
Author(s)	Zemanová, Adéla (UFM-A)_{RID, ORCID} Kroupa, Aleš (UFM-A)_{RID, ORCID}
Source Title	TOFA 2010 (Thermodynamics of Alloys 2010). - Porto, 2010 S. 46-46
Number of pages	1 s.
Action	TOFA 2010 (Thermodynamics of Alloys 2010)
Event date	12.09.2010-16.09.2010
VEvent location	Porto
Country	PT - Portugal
Event type	WRD
Language	eng - English
Country	PT - Portugal
Keywords	Cu-Ni-Sn system ; thermodynamic database ; lead-free soldering
Subject RIV	BJ - Thermodynamics
CEZ	AV0Z20410507 - UFM-A (2005-2011)
Annotation	The Cu-Ni-Sn system plays a crucial role in lead-free soldering and therefore, it is important to have its reliable description. The existing assessment of ternary Cu-Ni-Sn system published by Miettien has to be remodelled to include the newest results for binary and ternary systems. New extensive experimental results published by Schmetterer at al. and original results published in were used for the reassessment.
Workplace	Institute of Physics of Materials
Contact	Yvonna Šrámková, sramkova@ipm.cz, Tel.: 532 290 485
Year of Publishing	2011

Number of the records: 1