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Characterization of creep behaviour and microstructure changes in pure copper processed by equal-channel angular pressing. Part I. Creep behaviour

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    SYSNO ASEP0349224
    Document TypeJ - Journal Article
    R&D Document TypeJournal Article
    Subsidiary JČlánek ve WOS
    TitleCharacterization of creep behaviour and microstructure changes in pure copper processed by equal-channel angular pressing. Part I. Creep behaviour
    Author(s) Dvořák, Jiří (UFM-A) RID, ORCID
    Sklenička, Václav (UFM-A) RID, ORCID
    Král, Petr (UFM-A) RID, ORCID
    Svoboda, Milan (UFM-A) RID, ORCID
    Saxl, Ivan (MU-W) RID, SAI
    Number of authors5
    Source TitleReviews on Advanced Materials Science - ISSN 1606-5131
    Roč. 25, č. 3 (2010), s. 225-232
    Number of pages8 s.
    ActionInternational Symposium on Bulk Nanostructures Materials /2./
    Event date22.09.2009-26.09.2009
    VEvent locationUfa
    CountryRU - Russian Federation
    Event typeEUR
    Languageeng - English
    CountryRU - Russian Federation
    Keywordscreep ; copper ; ultrafine-grained ; ECAP
    Subject RIVJJ - Other Materials
    CEZAV0Z20410507 - UFM-A (2005-2011)
    AV0Z10190503 - MU-W (2005-2011)
    UT WOS000282497400005
    AnnotationCoarse-grained high-purity copper was processed by equal-channel angular pressing (ECAP) through 1-12 passes and then tested under creep conditions at temperature ranging from 423 to 523K It was found that the creep resistance of the ECAP processed material was markedly improved with respect to unpressed material. The results revealed that the creep behaviour of pressed material strongly depends on the number of ECAP passes The ECAP material exhibits the highest creep resistance after the first ECAP pass However, successive ECAP passes lead to a noticeable decrease in the creep properties of the pressed copper The results indicate conventional power-law creep with a stress exponent of similar to`5 - 6 which is consistent with an intragranular dislocation process involving the glide and climb of dislocations
    WorkplaceInstitute of Physics of Materials
    ContactYvonna Šrámková, sramkova@ipm.cz, Tel.: 532 290 485
    Year of Publishing2011
Number of the records: 1  

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