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Grain and subgrain boundaries in ultrafine-grained materials

SYSNO ASEP	0343467
Document Type	J - Journal Article
R&D Document Type	Journal Article
Subsidiary J	Článek ve WOS
Title	Grain and subgrain boundaries in ultrafine-grained materials
Author(s)	Saxl, Ivan (MU-W)_{RID, SAI} Kalousová, A. (CZ) Ilucová, Lucia (MU-W)_SAI Sklenička, Václav (UFM-A)_{RID, ORCID}
Source Title	Materials Characterization. - : Elsevier - ISSN 1044-5803 Roč. 60, č. 10 (2009), s. 1163-1167
Number of pages	5 s.
Language	eng - English
Country	US - United States
Keywords	Grain boundaries ; ECAP ; Aluminium ; Copper
Subject RIV	BA - General Mathematics
R&D Projects	GA201/06/0302 GA ČR - Czech Science Foundation (CSF)
CEZ	AV0Z10190503 - MU-W (2005-2011)
	AV0Z20410507 - UFM-A (2005-2011)
UT WOS	000271368200016
DOI	10.1016/j.matchar.2009.03.010
Annotation	The attractive metallographic electron backscatter diffraction (EBSD) method is used to describe the effect of the number N of passes on the subgrain and grain structures of pure aluminium and copper processed by equal channel angular pressing (ECAP). The remarkable feature of the aluminium structure is the lack of high angle boundaries after a low number (N = 2, 4) of passes and this remains preserved even after a relatively long annealing time. On the other hand, the boundary structure of copper is relatively stable and high angle boundaries always prevail.
Workplace	Mathematical Institute
Contact	Jarmila Štruncová, struncova@math.cas.cz, library@math.cas.cz, Tel.: 222 090 757
Year of Publishing	2011

Number of the records: 1