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Microstructure of the ultra-fine grained Cu by UHV SLEEM
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SYSNO ASEP 0335272 Document Type C - Proceedings Paper (int. conf.) R&D Document Type Conference Paper Title Microstructure of the ultra-fine grained Cu by UHV SLEEM Author(s) Mikmeková, Šárka (UPT-D) RID, SAI, ORCID
Hovorka, Miloš (UPT-D)
Müllerová, Ilona (UPT-D) RID, SAI, ORCID
Frank, Luděk (UPT-D) RID, SAI, ORCID
Man, O. (CZ)
Pantělejev, L. (CZ)Number of authors 6 Source Title MC 2009 - Microscopy Conference: First Joint Meeting of Dreiländertagung and Multinational Conference on Microscopy. - Graz : Verlag der Technischen Universität, 2009 - ISBN 978-3-85125-062-6 Pages vol. 3: 515-516 Number of pages 2 s. Action MC 2009 - Joint Meeting of Dreiländertagung and Multinational Congress on Microscopy /9./ Event date 30.08.2009-04.09.2009 VEvent location Graz Country AT - Austria Event type WRD Language eng - English Country AT - Austria Keywords scanning low energy electron microscopy ; EBSD ; grain contrast in SEM ; ultrafine grained materials Subject RIV JA - Electronics ; Optoelectronics, Electrical Engineering R&D Projects OE08012 GA MŠMT - Ministry of Education, Youth and Sports (MEYS) CEZ AV0Z20650511 - UPT-D (2005-2011) Annotation Study of materials with ultra-fine structure belongs nowadays to fronted areas of research of the material engineering. Ultra-fine grained (UFG) materials are defined as polycrystals with very small grains of average grain sizes below 1 micrometer. These materials are very attractive for many industrial applications (including aerospace, automotive, biomaterials, chemical sensors, construction, electronics, metal forming, etc.) because of their interesting mechanical and physical properties surpassing those of common materials. The superior mechanical properties include ultra high strength and superplasticity. Workplace Institute of Scientific Instruments Contact Martina Šillerová, sillerova@ISIBrno.Cz, Tel.: 541 514 178 Year of Publishing 2010
Number of the records: 1