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Copper nitride thin films prepared by the RF plasma chemical reactor with low pressure supersonic single and multi-plasma jet system
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SYSNO ASEP 0132837 Document Type J - Journal Article R&D Document Type Journal Article Subsidiary J Ostatní články Title Copper nitride thin films prepared by the RF plasma chemical reactor with low pressure supersonic single and multi-plasma jet system Author(s) Soukup, Ladislav (FZU-D)
Šícha, M. (CZ)
Fendrych, František (FZU-D) RID, ORCID, SAI
Jastrabík, Lubomír (FZU-D) RID, ORCID
Hubička, Zdeněk (FZU-D) RID, ORCID, SAI
Chvostová, Dagmar (FZU-D) RID, SAI, ORCID
Šíchová, H. (CZ)
Valvoda, V. (CZ)
Tarasenko, A. A. (UA)
Studnička, Václav (FZU-D) RID
Wagner, T. (DE)
Novák, Miloš (FZU-D)Source Title Surface and Coatings Technology. - : Elsevier - ISSN 0257-8972
116-119, - (1999), s. 321-326Number of pages 6 s. Action International Congerence on Plasma Surface Engineering /6./ Event date 14.09.1998-18.09.1998 VEvent location Garmisch-Partenkirchen Country DE - Germany Language eng - English Country CH - Switzerland Subject RIV BM - Solid Matter Physics ; Magnetism R&D Projects IPP1067701 GA AV ČR - Academy of Sciences of the Czech Republic (AV ČR) CEZ AV0Z1010914 - FZU-D Annotation The RF plasma chemical reactor with low pressure superionic plasma jet system has been used for deposition of Cu3N thin films. Workplace Institute of Physics Contact Kristina Potocká, potocka@fzu.cz, Tel.: 220 318 579 Year of Publishing 2001
Number of the records: 1