Number of the records: 1
Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition
- 1.Kunz, Ludvík - Lukáš, Petr - Pantělejev, L. - Man, O.
Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition.
Strain. Roč. 2011, č. 47 (2011), 476–482. ISSN 0039-2103. E-ISSN 1475-1305
Impact factor: 1.103, year: 2011
http://hdl.handle.net/11104/0006707
Number of the records: 1