Grain and subgrain boundaries in ultrafine-grained materials

0343467 - MÚ 2011 RIV US eng J - Journal Article
Saxl, Ivan - Kalousová, A. - Ilucová, Lucia - Sklenička, Václav
Grain and subgrain boundaries in ultrafine-grained materials.
Materials Characterization. Roč. 60, č. 10 (2009), s. 1163-1167. ISSN 1044-5803. E-ISSN 1873-4189
R&D Projects: GA ČR GA201/06/0302
Institutional research plan: CEZ:AV0Z10190503; CEZ:AV0Z20410507
Keywords : Grain boundaries * ECAP * Aluminium * Copper
Subject RIV: BA - General Mathematics
Impact factor: 1.416, year: 2009

The attractive metallographic electron backscatter diffraction (EBSD) method is used to describe the effect of the number N of passes on the subgrain and grain structures of pure aluminium and copper processed by equal channel angular pressing (ECAP). The remarkable feature of the aluminium structure is the lack of high angle boundaries after a low number (N = 2, 4) of passes and this remains preserved even after a relatively long annealing time. On the other hand, the boundary structure of copper is relatively stable and high angle boundaries always prevail.
Permanent Link: http://hdl.handle.net/11104/0185942