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Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition
- 1.Kunz, L., Lukáš, P., Pantělejev, L., Man, O. Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition. Strain. 2011, 2011(47), 476–482. ISSN 0039-2103. E-ISSN 1475-1305. Available: doi: 10.1111/j.1475-1305.2009.00710.x
Number of the records: 1