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Robust Local Thickness Estimation of Sub-Micrometer Specimen by 4D-STEM

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    SYSNO ASEP0579321
    Document TypeJ - Journal Article
    R&D Document TypeJournal Article
    Subsidiary JČlánek ve WOS
    TitleRobust Local Thickness Estimation of Sub-Micrometer Specimen by 4D-STEM
    Author(s) Skoupý, Radim (UPT-D) RID, ORCID, SAI
    Boltje, D. B. (NL)
    Šlouf, Miroslav (UMCH-V) RID, ORCID
    Mrázová, Kateřina (UPT-D) SAI, ORCID, RID
    Láznička, Tomáš (UPT-D) ORCID, RID, SAI
    Taisne, C. M. (NL)
    Krzyžánek, Vladislav (UPT-D) RID, ORCID, SAI
    Hoogenboom, J. P. (NL)
    Jakobi, A. J. (NL)
    Number of authors9
    Article number2300258
    Source TitleSmall Methods. - : Wiley - ISSN 2366-9608
    Roč. 7, č. 9 (2023)
    Number of pages11 s.
    Publication formOnline - E
    Languageeng - English
    CountryUS - United States
    Keywords4D-STEM ; cryo-ET ; FIB milling ; TEM analysis
    Subject RIVJA - Electronics ; Optoelectronics, Electrical Engineering
    OECD categoryElectrical and electronic engineering
    R&D ProjectsGA21-13541S GA ČR - Czech Science Foundation (CSF)
    TN01000008 GA TA ČR - Technology Agency of the Czech Republic (TA ČR)
    Method of publishingOpen access
    Institutional supportUPT-D - RVO:68081731 ; UMCH-V - RVO:61389013
    UT WOS000997748800001
    EID SCOPUS85160667652
    DOI10.1002/smtd.202300258
    AnnotationA quantitative four-dimensional scanning transmission electron microscopy (4D-STEM) imaging technique (q4STEM) for local thickness estimation across amorphous specimen such as obtained by focused ion beam (FIB)-milling of lamellae for (cryo-)TEM analysis is presented. This study is based on measuring spatially resolved diffraction patterns to obtain the angular distribution of electron scattering, or the ratio of integrated virtual dark and bright field STEM signals, and their quantitative evaluation using Monte Carlo simulations. The method is independent of signal intensity calibrations and only requires knowledge of the detector geometry, which is invariant for a given instrument. This study demonstrates that the method yields robust thickness estimates for sub-micrometer amorphous specimen using both direct detection and light conversion 2D-STEM detectors in a coincident FIB-SEM and a conventional SEM. Due to its facile implementation and minimal dose reauirements, it is anticipated that this method will find applications for in situ thickness monitoring during lamella fabrication of beam-sensitive materials.
    WorkplaceInstitute of Scientific Instruments
    ContactMartina Šillerová, sillerova@ISIBrno.Cz, Tel.: 541 514 178
    Year of Publishing2024
    Electronic addresshttps://onlinelibrary.wiley.com/doi/10.1002/smtd.202300258
Number of the records: 1  

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