Low conductive thermal insulation pad with high mechanical stiffness

Number of the records: 1

1.

SYSNO	0568471
Title	Low conductive thermal insulation pad with high mechanical stiffness
Author(s)	Hanzelka, Pavel (UPT-D)_{RID, ORCID, SAI} Dupák, Libor (UPT-D)_{ORCID, RID, SAI} Krutil, Vojtěch (UPT-D)_{ORCID, RID, SAI} Krzyžánek, Vladislav (UPT-D)_{RID, ORCID, SAI} Skoupý, Radim (UPT-D)_{RID, ORCID, SAI} Srnka, Aleš (UPT-D)_{RID, ORCID, SAI} Vlček, Ivan (UPT-D)_{RID, ORCID, SAI} Urban, Pavel (UPT-D)_{RID, ORCID, SAI}
Corespondence/senior	Urban, Pavel - Korespondující autor
Source Title	16th Multinational Congress on Microscopy, 16MCM, 04-09 September 2022, Brno, Czech Republic. Book of abstracts. S. 152-153. - Brno : Czechoslovak Microscopy Society, 2022 / Krzyžánek V. ; Hrubanová K. ; Hozák P. ; Müllerová I. ; Šlouf M.
Conference	Multinational Congress on Microscopy /16./, 04.09.2022 - 09.09.2022, Brno
Document Type	Abstrakt
Grant	TE01020233 GA TA ČR - Technology Agency of the Czech Republic (TA ČR)
Institutional support	UPT-D - RVO:68081731
Language	eng
Country	CZ
Keywords	Cryogenics * Thermal insulation * Microscopy * Sample holder
URL	https://www.16mcm.cz/wp-content/uploads/2022/09/16MCM-abstract-book.pdf
Permanent Link	https://hdl.handle.net/11104/0339783

Number of the records: 1