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W plus Cu and W plus Ni Composites and FGMs Prepared by Plasma Transferred Arc Cladding

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    SYSNO ASEP0555697
    Document TypeJ - Journal Article
    R&D Document TypeJournal Article
    Subsidiary JČlánek ve WOS
    TitleW plus Cu and W plus Ni Composites and FGMs Prepared by Plasma Transferred Arc Cladding
    Author(s) Matějíček, Jiří (UFP-V) RID, ORCID
    Antoš, J. (CZ)
    Rohan, P. (CZ)
    Number of authors3
    Article number789
    Source TitleMaterials. - : MDPI
    Roč. 14, č. 4 (2021)
    Number of pages11 s.
    Languageeng - English
    CountryCH - Switzerland
    Keywordsplasma-facing materials ; W-based composites ; PTA cladding
    Subject RIVJP - Industrial Processing
    OECD categoryMaterials engineering
    R&D ProjectsGA17-23154S GA ČR - Czech Science Foundation (CSF)
    Method of publishingOpen access
    Institutional supportUFP-V - RVO:61389021
    UT WOS000624097200001
    DOI10.3390/ma14040789
    AnnotationTungsten-based materials are the most prospective candidates for plasma-facing components of future fusion devices, such as DEMO. W-based composites and graded layers can serve as stress-relieving interlayers for the joints between plasma-facing armor and the cooling or structural parts. Coating/cladding techniques offer the advantages of eliminating the joining step and the ability to coat large areas, even on nonplanar shapes. In this work, W + Cu and W + Ni composites were prepared by pulsed plasma transferred arc (PTA) cladding on several different substrates. Optimization of the process was carried out with respect to powder mixture composition and process parameters like arc current, plasma gas composition, and traverse velocity. Dense claddings of several millimeters thickness and various W content were achieved. Moreover, multilayers with W content gradually varying from 47 to 92% were formed. The structure, compositional profiles, and thermal properties of the claddings were characterized.
    WorkplaceInstitute of Plasma Physics
    ContactVladimíra Kebza, kebza@ipp.cas.cz, Tel.: 266 052 975
    Year of Publishing2022
    Electronic addresshttps://www.mdpi.com/1996-1944/14/4/789
Number of the records: 1  

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