Number of the records: 1  

Characterization of hydrogenated silicon thin films and diode structures with integrated germanium nanoparticles

  1. 1.
    SYSNO ASEP0496537
    Document TypeC - Proceedings Paper (int. conf.)
    R&D Document TypeConference Paper
    TitleCharacterization of hydrogenated silicon thin films and diode structures with integrated germanium nanoparticles
    Author(s) Stuchlík, Jiří (FZU-D) RID, ORCID
    Fajgar, Radek (UCHP-M) RID, ORCID, SAI
    Kupčík, Jaroslav (UCHP-M) RID, ORCID, SAI
    Remeš, Zdeněk (FZU-D) RID, ORCID
    Stuchlíková, The-Ha (FZU-D) RID, ORCID
    Number of authors5
    Source TitleNanocon 2017 : conference proceedings : 9th International Conference on Nanomaterials - Research & Application. - Ostrava : Tanger Ltd., 2018 - ISBN 9788087294819
    Pagess. 123-127
    Number of pages5 s.
    Publication formOnline - E
    ActionNANOCON 2017. International Conference on Nanomaterials - Research & Application /9./
    Event date18.10.2017 - 20.10.2017
    VEvent locationBrno
    CountryCZ - Czech Republic
    Event typeWRD
    Languageeng - English
    CountryCZ - Czech Republic
    KeywordsPECVD ; a-Si:H diode structures ; Ge ; nanoparticles
    Subject RIVBM - Solid Matter Physics ; Magnetism
    OECD categoryCondensed matter physics (including formerly solid state physics, supercond.)
    Subject RIV - cooperationInstitute of Chemical Process Fundamentals - Physical ; Theoretical Chemistry
    R&D ProjectsLTC17029 GA MŠMT - Ministry of Education, Youth and Sports (MEYS)
    Institutional supportFZU-D - RVO:68378271 ; UCHP-M - RVO:67985858
    AnnotationSubstrates with ZnO (or ITO) conductive layers were covered by thin film of a-Si:H deposited by PECVD technique. Under a turbo-molecular vacuum (10-4 Pa) the reactive laser ablation (RLA) was used to cover this a-Si:H thin film by germanium NPs. The RLA was performed using focused excimer ArF laser beam (193 nm, 100 mJ/pulse) under SiH4 background atmosphere (0.5 Pa). As a target the elemental germanium was used. Reaction between ablated Ge and silane led to formation of Ge NPs covered by thin SiGe layer. Then the deposited NPs were covered and stabilized by a-Si:H layer by PECVD. Those two deposition processes was alternated and applied a few times. The Si:H thin films with integrated Ge NPs were characterized by microscopic, spectroscopic and diffraction techniques. I-V characteristics of final diode structures without and under illumination were measured as well as their electroluminescence behaviour.
    WorkplaceInstitute of Physics
    ContactKristina Potocká, potocka@fzu.cz, Tel.: 220 318 579
    Year of Publishing2019
Number of the records: 1  

  This site uses cookies to make them easier to browse. Learn more about how we use cookies.